Adhesive application systems from Robatech apply hot melt or cold glue economically, quickly, and precisely to packaging materials such as cardboard, paperboard, glass, or plastic. Our modular application systems can be flexibly adapted to your packaging process and easily integrated into higher-level systems.
With our innovative Robatech Control System (RCS), we provide you with a platform with open interfaces and standardized Fieldbus protocols. If required, you can control the adhesive application directly via your cartoning machine, end-of-line packaging machine, or similar equipment. RCS is ready for Industry 4.0.