Newsroom | Robatech Adhesive Application Systems

Modular Robatech systems strengthen OEM competitiveness | Robatech

Written by Robatech author | 18. February 2020

High speeds and specific customer requirements for end-of-line packaging systems require high-quality technologies and adaptability. Turkish machine builder Vervo Advanced Packaging Technologies achieves great flexibility for the optimal configuration of wrap-around packaging machines thanks to modular hot melt application systems from Robatech.

“With Robatech, we can offer our customers various hot-melt adhesive application systems and configure the most optimal variants for the desired customer applications on our machines,” explains Ali Ekrem Özüzümcü, Vervo Business Development & Advanced Packaging Technologies, enthusiastically. “The hot melt adhesive application heads of the SX Diamond family operate quickly and precisely. The various jetting elements and valve heads can be combined. This allows for easy adjustment of the application angle and quick format changes.”

 

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