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Where Robatech meets packaging

21. July 2020
Where Robatech meets packaging

Robatech has planned to present gluing solutions for optimized adhesive application at several packaging trade fairs worldwide, scheduled for September to November 2020. The respective participation will depend on the local Covid-19 situation.

Robatech experts will be happy to meet you at the trade fair booth to discuss how you can perform even better in adhesive application. Highlights will be easy and smart functions to control, monitor and operate gluing processes, palletizing packaging units without plastic foils and new product features for less standstills.

Use the overview to comfortably plan your trade fair visits and to get free tickets where available. Robatech will strictly adhere to the trade fairs' hygiene and infection protection concepts for keeping you and our staff safe.

INNOPACK PHARMA CONFEX

Mumbai, India
03. – 04.09.2020
Booth / Hall

FOODTECH PACKTECH

Auckland, New Zealand
22. – 24.09.2020
Booth 3004 / Hall A

CFIA

Rennes, France
29.09. – 01.10.2020
Booth D28 / Hall 10

EURASIA PACKAGING ISTANBUL FAIR

Istanbul, Turkey
21. – 24.10.2020
Booth / Hall

BUCHAREST PACKAGING

Bucharest, Romania
28.10. – 01.11.2020
Booth / Hall

RENDEZ-VOUS EMBALLAGE

Lausanne, Switzerland
03.11.2020

PACKEXPO INTERNATIONAL

Chicago, USA
08. – 11.11.2020
Booth S-4386

EXPOBONDING

Sosnowiec, Poland
21. – 22.11.2020
Booth

ALL4PACK

Paris, France
23. – 26.11.2019
Booth E033 / Hall 6

EMPACK

Madrid, Spain
25. – 26.11.2019
Booth I27 / Hall 10

PACKEX

Mumbai, India
26. – 28.11.2020
Booth / Hall

 
Robatech AG
Pilatusring 10
5630 Muri
Schweiz
Tel +41 56 675 77 00
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