Experience Gluing with Perfection
PRINTPACK INDIA (Feb 01 - 06, 2019), Greater Noida: Robatech shows innovative and secure adhesive application for an enhanced experience.
Packed with ideas and solutions that power innovation, Robatech participates at PRINTPACK INDIA. From February 01 - 06, 2019 you can meet cutting-edge technologies and services for an optimized gluing process on our booth J77, hall 14 in Greater Noida.
Robatech offers complete adhesive application solutions with hot melt and cold glue systems, among others, for the packaging industry. Witness how the precise adhesive application equipment supports an efficient and safe production with maximum uptime. We are looking forward to meeting you and helping you optimizing your gluing process for better performance and reliability in your gluing processes.
Be our guest and see our innovative products on display in Greater Noida!