Contactless Bead Application:
The application heads of series ECXM are electromagnetically controlled glue heads for rapid dot or line applications at high machine speeds. They work with adhesive pressures up to 25 bar and viscosities up to 2,500 mPas.
For the application without contact of cold glues in the low- to medium-viscosity range at a high system pressure. For precise dot and line applications as required in the packaging, printing and cardboard processing industries.
The fully electric CTE multi-line applicator heads are dedicated to glue the flaps of cartons of corrugated cardboard, enabling a glue application in different widths and in this way adapt to the width of the flap. They can be installed turned by 90°, so that another bead distance results. Valves can also be deactivated so that the application of only one glue bead is possible.
In Contact Bead Application:
Jetting Heads ECXM-WT Series
The application heads of series ECXM-WT are electromagnetically controlled glue heads for rapid dot or line applications at high machine speeds. They are suitable for average viscous dispersion adhesive. The heads are equipped with a precise carbide nozzle for the in contact applications. They are mainly used for cold glueing and softening systems (Webtack-System) in the printing industry.
Leaflets
